BGA Rework Station China Engineering Lab Training System Suppliers
quality heating material form high temperature breeze; desoldering and soldering procedures of BGA are precisely controlled;
Removable heating header, easy to operate;
Touch screen interface, PLC control; real-time temperature curve display, able to display two detecting curves at the same time;
6 segments of temperature up (down) and 6 segments constant temperature control, 50 groups of temperature curve are stored, Curve analysis can be carried out on the touch screen.
Able to arrive at three independent temperature zone, temperature and time can be displayed digitally on the touch screen.
Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; heating board is independent controlled;
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage
Powerful cross flow fans cool the lower heating area rapidly;
PCB rack is adjustable for protecting your hands from hot;
Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA;
Over-heating alarm and protection for the upper hot gas heating header.
With different Ti alloy hot gas nozzles, easy to replace.
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PCB dimension |
W50×D50~W400×D300mm |
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PCB thickness |
0.5~3mm |
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Working table adjustment |
±50mm forward/backward, ±200mm left/right |
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Temperature control |
K-type thermocouple, close cycle controlled |
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PCB locating way |
Outer or jig |
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Bottom heater |
infrared, 3000W |
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Nozzle heater |
hot air,1000W |
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Power supply |
single-phase 220V, 50/60Hz, 3.5KVA |
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Gas supply |
5~8kgf/cm,2.5L/min |
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